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FPC crimping process - List of Manufacturers, Suppliers, Companies and Products

FPC crimping process Product List

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FPC crimping process

Compatible with ACP and ACF! We will attach FPC to the boards processed by our company or the boards you provide!

We offer "FPC bonding processing." The alignment accuracy is ±0.2mm. We can accommodate ACP and ACF, and we can bond FPC to both processed substrates and supplied substrates. Processing is possible for glass substrates up to a maximum size of 300mm × 300mm. Please consult us separately regarding FPC sizes. 【Features】 <Processing Size> ■ MAX: Processing is possible for glass substrates up to 300mm × 300mm ■ MIN: 100mm × 100mm (FPC sizes are available for separate consultation) <Processing Accuracy> ■ Alignment: Accuracy ±0.2mm *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • Processing Contract

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